Demo Stage Agenda | Kisaco Research
12:30 PM
Expo Ticket Entry Opens

Expo Ticket Entry Opens

9 Sept 2025
Expo Hall Networking

Expo Hall Networking

9 Sept 2025
1:00 PM
MLCommons - MLPerf Inference Results

Following the MLCommons Q3 MLPerf Inference results announcement on the morning of Tuesday 9th September on the keynote stage, MLCommons Founder & Executive Director David Kantar will deliver a detailed analysis of the results followed by a Q&A session from the audience. 

David Kanter

David Kanter

Founder & Executive Director

MLCommons

In partnership with

MLCommons - MLPerf Inference Results

9 Sept 2025
In partnership with

Following the MLCommons Q3 MLPerf Inference results announcement on the morning of Tuesday 9th September on the keynote stage, MLCommons Founder & Executive Director David Kantar will deliver a detailed analysis of the results followed by a Q&A session from the audience. 

David Kanter

David Kanter

Founder & Executive Director
MLCommons

1:30 PM
Full Stack Infra
Rebellions Product Demo

In partnership with

Rebellions Product Demo

9 Sept 2025
In partnership with
1:45 PM
Full Stack Infra
Google Product Demo

In partnership with

Google Product Demo

9 Sept 2025
In partnership with
2:00 PM
Full Stack Infra
ZETIC.MLange: From GPU Cloud based AI Server to Server-less AI App in Hours

Beyond Benchmarks to Real Products:
Automatically convert trained AI models into optimized mobile apps, ready to deploy within hours—no app development required.

End-to-End Automated Pipeline:
Seamlessly perform AI model conversion, device-specific optimization (NPU/GPU/CPU), and automatic SDK and app template generation (Android, iOS, Flutter).

Real-World Impact & Use Cases:
Proven deployments across industries including healthcare and enterprise, delivering immediate value through reduced costs, enhanced data security, and superior real-time performance.

Yeonseok Kim

Yeonseok Kim

CEO

Zetic

In partnership with

ZETIC.MLange: From GPU Cloud based AI Server to Server-less AI App in Hours

9 Sept 2025
In partnership with

Beyond Benchmarks to Real Products:
Automatically convert trained AI models into optimized mobile apps, ready to deploy within hours—no app development required.

End-to-End Automated Pipeline:
Seamlessly perform AI model conversion, device-specific optimization (NPU/GPU/CPU), and automatic SDK and app template generation (Android, iOS, Flutter).

Real-World Impact & Use Cases:
Proven deployments across industries including healthcare and enterprise, delivering immediate value through reduced costs, enhanced data security, and superior real-time performance.

Yeonseok Kim

Yeonseok Kim

CEO
Zetic

2:15 PM
Full Stack Infra
Microsoft Product Demo

2:15 PM - 2:30 PM

In partnership with

Microsoft Product Demo

9 Sept 2025 2:15 PM - 2:30 PM
In partnership with
2:30 PM
Data Movement & Management Track
Rethinking AI Fiber Connectivity: The Spreadable Adapter Advantage

2:30 PM - 2:45 PM

As AI accelerates, the data center’s optical infrastructure faces unprecedented demands. To support this transformation, we knew that connectivity as usual wouldn’t cut it and explored a new dimension of fiber innovation, Spreadable Adapter Technology. This patented breakthrough streamlines installations, enhances port access, and reduces accidental disconnects, optimizing uptime in dense AI environments. Faster moves, adds, and changes minimize friction, saving time and reducing costs. As AI pushes data centers further and faster, Spreadable Adapters are redefining efficiencies at the physical layer. We’ll share how this technology is shaping AI networks and unlocking new possibilities for scalable, high-performance infrastructure solutions.

Brian Berdan

Brian Berdan

Sr Product Manager

Go!Foton

In partnership with

Rethinking AI Fiber Connectivity: The Spreadable Adapter Advantage

9 Sept 2025 2:30 PM - 2:45 PM
In partnership with

As AI accelerates, the data center’s optical infrastructure faces unprecedented demands. To support this transformation, we knew that connectivity as usual wouldn’t cut it and explored a new dimension of fiber innovation, Spreadable Adapter Technology. This patented breakthrough streamlines installations, enhances port access, and reduces accidental disconnects, optimizing uptime in dense AI environments. Faster moves, adds, and changes minimize friction, saving time and reducing costs. As AI pushes data centers further and faster, Spreadable Adapters are redefining efficiencies at the physical layer. We’ll share how this technology is shaping AI networks and unlocking new possibilities for scalable, high-performance infrastructure solutions.

Brian Berdan

Brian Berdan

Sr Product Manager
Go!Foton

2:45 PM
Data Movement & Management Track
Networking Product Demo

2:45-3:00

Networking Product Demo

9 Sept 2025 2:45-3:00
3:15 PM
Data Movement & Management Track
CPX: 224 Gbps PAM4 CPC/CPO Interconnect Solutions for Single Substrate AI Accelerators

Matthew Burns

Matthew Burns

Global Director, Technical Marketing

Samtec

CPX: 224 Gbps PAM4 CPC/CPO Interconnect Solutions for Single Substrate AI Accelerators

9 Sept 2025

Matthew Burns

Matthew Burns

Global Director, Technical Marketing
Samtec

3:30 PM
Data Movement & Management Track
Innodisk Product Demo

In partnership with

Innodisk Product Demo

9 Sept 2025
In partnership with
4:00 PM
Data Movement & Management Track
UEC Panel

In partnership with

UEC Panel

9 Sept 2025
In partnership with
4:30 PM
Data Movement & Management Track
Generative AI Infrastructure: How GPUs, AI ASICs, and Networking Chips Shape Datacenters

4:00 PM - 4:30 PM

Generative AI is fundamentally changing how datacenters are built, putting three types of silicon center-stage: GPUs, custom AI ASICs, and advanced networking processors. Driven by these technologies, the datacenter processor market soared to $147 billion in 2024 and is expected to double by 2030, largely thanks to explosive growth in GPUs and specialized AI ASICs.

While GPUs remain the reference for AI training and inference, hyperscale providers, eager to reduce their dependence on Nvidia, are increasingly co-designing specialized AI ASICs with chipmakers like Broadcom, Marvell, and Alchip. These ASICs sacrifice some versatility to achieve superior performance and energy efficiency, creating opportunities for a thriving startup scene featuring companies like Groq, Cerebras, and Tenstorrent, and spurring major waves of venture investment and mergers. Crucially, chiplet architectures, which combine multiple smaller chip components into a single, optimized package, are now key to driving GPU and ASIC performance upward, beyond what traditional single-chip designs can deliver.

As AI models become ever larger and require responses within milliseconds, networking silicon has become just as critical as processors themselves. DPUs, smart network cards, and advanced switches now coordinate massive arrays of accelerators, making both scale-up and scale-out networks a pivotal part of datacenter performance.

Adrien Sanchez

Adrien Sanchez

Senior Technology & Market Analyst, Computing & Software

Yole Intelligence

Hugo Antoine

Hugo Antoine

Technology & Market Analyst, Computing & Software

Yole Group

Generative AI Infrastructure: How GPUs, AI ASICs, and Networking Chips Shape Datacenters

9 Sept 2025 4:00 PM - 4:30 PM

Generative AI is fundamentally changing how datacenters are built, putting three types of silicon center-stage: GPUs, custom AI ASICs, and advanced networking processors. Driven by these technologies, the datacenter processor market soared to $147 billion in 2024 and is expected to double by 2030, largely thanks to explosive growth in GPUs and specialized AI ASICs.

While GPUs remain the reference for AI training and inference, hyperscale providers, eager to reduce their dependence on Nvidia, are increasingly co-designing specialized AI ASICs with chipmakers like Broadcom, Marvell, and Alchip. These ASICs sacrifice some versatility to achieve superior performance and energy efficiency, creating opportunities for a thriving startup scene featuring companies like Groq, Cerebras, and Tenstorrent, and spurring major waves of venture investment and mergers. Crucially, chiplet architectures, which combine multiple smaller chip components into a single, optimized package, are now key to driving GPU and ASIC performance upward, beyond what traditional single-chip designs can deliver.

As AI models become ever larger and require responses within milliseconds, networking silicon has become just as critical as processors themselves. DPUs, smart network cards, and advanced switches now coordinate massive arrays of accelerators, making both scale-up and scale-out networks a pivotal part of datacenter performance.

Adrien Sanchez

Adrien Sanchez

Senior Technology & Market Analyst, Computing & Software
Yole Intelligence

Hugo Antoine

Hugo Antoine

Technology & Market Analyst, Computing & Software
Yole Group

5:00 PM
AI Hardware Track
Vaire Product Demo

Alex Fleetwood

Alex Fleetwood

Chief Solutions Architect

Vaire

Vaire Product Demo

9 Sept 2025

Alex Fleetwood

Alex Fleetwood

Chief Solutions Architect
Vaire

5:15 PM
AI Hardware Track
Google Product Demo

In partnership with

Google Product Demo

9 Sept 2025
In partnership with
5:30 PM
Women in AI Session
Powering Women in AI Infrastructure

Nalini Garg

Nalini Garg

California State Ambassador

Women In AI

Ipsita Mohanty

Ipsita Mohanty

Vice Chair

IEEE Women in Engineering

Shweta Behere

Shweta Behere

Senior Engineering Manager

Workday

In partnership with

Powering Women in AI Infrastructure

9 Sept 2025
In partnership with

Nalini Garg

Nalini Garg

California State Ambassador
Women In AI

Ipsita Mohanty

Ipsita Mohanty

Vice Chair
IEEE Women in Engineering

Shweta Behere

Shweta Behere

Senior Engineering Manager
Workday

6:10 PM
Opening Gala Drinks Reception

Opening Gala Drinks Reception

9 Sept 2025
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